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SMT SMD 1808 FUSE 250MA-15A – Gunung permukaan seramik bertindak pantas 2410
SMT/SMD – 1808/2410 Fius bertindak pantas – Wire-in-Air (Wia) Fuse Mount Surface Shape Square 6.1mm x 2.69mm x 2.69mm – Rated to 250V (250ma, 500ma, 1A, 2A, 3A, 5A) – Rated to 125V (8A, 10A, 12A, 15A) .
![]() Gunung permukaan seramik bertindak pantas 2410 Fuse |
![]() 20Fius seramik 25A 30A 40A 1808 2410 6125 6.1 2.5Surface Mount Surface Fius |
![]() 1808 2410 SMD Fuse cepat bertindak fius seramik permukaan gunung 250V 300V SMT Chip Fuse |
| Nama Item: | 1808 SMD Fuse Fast Acting Ceramic Fuse Surface Mount Chip For Com-Communications | Bahagian No.: | SEF SSF SFE |
| Jenis Blow: | Fast Acting, Quick Blow | Jenis pemasangan: | Permukaan gunung |
| Standard: | UL 248-14 | Bahan badan: | Ceramic |
| Bahan topi: | Gold Or Silver Plated Brass | Bahan fusing: | Cu-Ag Alloy |
| Penilaian voltan: | 125V 250V 300V | Penilaian semasa: | 0.25A~15A |
| Digunakan untuk: | 6.1×2.5×2.5mm | UL disenaraikan: | Ya |
| Mematuhi ROHS: | Ya | Halogen percuma: | Ya |
| Mpq: | 1000pcs Per Reel | ||
| Cahaya tinggi: | 15A Surface Mount Fuses, 6.1mm Surface Mount Fuses, 1808 SMD FUSE | ||
Penerangan Produk
1808 SMD Fuse Fast Acting Ceramic Fuse Surface Mount Chip for Com-Communications
| Item | SMD FUSE |
| Standard | UL |
| Jenis Blow | fast blow |
| Bahan badan | seramik |
| Bahan fusing | Cu-Ag alloy |
| Bahan topi | tembaga, plated with silver or gold |
| Penilaian voltan | 250V 125V 300V |
| Penilaian semasa | 0.05A~15A |
| Jenis pemasangan | Permukaan gunung |
| Kapasiti pecah | 50A |
| Saiz | 6.1×2.5.x2.5mm |
| Pensijilan | CUL UL |
Product Features of Surface mount ceramic chip fuse
Saiz kecil(6.1mm*2.5mm)
Conflict free metals
Lead-Free and RoHS compliant
lnrush with stand capability
Wide range of current rating (125V/250V/30oV)
Wide range of current rating (50mA-15A)
Excellent environmental integrity
Wide rangc of current rating availablcLow temperature de-rating
Tape and Reel for automatic SMT placement
Aplikasi
| Pencahayaan LED | Networking devices | Game console |
| Notebook PC | PC server | Office equipment |
| Battery devices | Cooling fan system | Digital camera |
| LCD/PDP devices | Storage system | Peralatan perubatan |
| LCD backlight inverter | Telecom system | Automotive devices |
| Portable Devices | Wireless base station | LED driver |
| Power supply | White goods | lndustrial equipment |
Suhu operasi: -55℃ to +125℃ (Consider de-rating)
Stored condition: at temperature of +10℃~60℃, relative humidity ≤ 75%.
A:Soldering pot temperature: 260℃ Max; Solder dwell time: <5s (Wave Soldering)
B:Solder Iron Temperature: 350± 5 ℃, heating time: 1~2s. (Hand Soldering)
Drawing of the 1808 2410 250V 300V SMD fuse
Electrical Characteristics at 25℃
| Ampere Rating | % of Current Rating | Masa meniup |
| 0.05A~15A | 100% | >4 jam |
| 0.05A~15A | 200% | <120Sec |
Normal amperes: 250mA 315mA 375mA 0.4A 0.5A 0.63A 0.75A 0.8A 1A 1.25A 1.6A 2A
2.5A 3A 3.15A 3.5A 4A 5A 6.3A 7A 8A 12A 15A (125V 250V 300V)
Nota: (1) Permissible continuous operating current is ≤100% at ambient temperature of 23°C (73.4° f)
(2) The current values used for calculating I2T should be within the standard 10In.
(3) The TUV certification only for 250VAC and 125VDC; the CQC, KC certification only for 250V; the cURus certification for all voltage.
(4) 250mA No sand filling

SMT SMD 1808 Fuse Selection

Drawing of the 1808 2410 250V 300V SMD fuse
Average Current Curve (I-T Curve)
Hubungi kami
Menunggu e -mel anda, Kami akan membalas anda dalam 12 Jam dengan maklumat berharga yang anda perlukan.
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